发明名称 |
SEMICONDUCTOR DEVICE FOR REDUCING RESISTANCE OF CELL PAD CONTACT AND MANUFACTURING METHOD THEREOF |
摘要 |
PURPOSE: A semiconductor device for reducing the resistance of a cell pad contact and a manufacturing method thereof are provided to be capable of preventing the reduction of effective channel length of a gate. CONSTITUTION: A semiconductor device for reducing the resistance of a cell pad contact is provided with a gate oxide layer, a gate(280) formed at the upper portion of the gate oxide layer, and a spacer(290) formed at both sidewalls of the gate. The semiconductor device further includes the first insulating layer(320-1) formed at the upper portion of the resultant structure and a cell pad contact hole formed at the first insulating layer for partially exposing a semiconductor substrate(100). The second poly layer(380-1) is formed at the upper portion of the resultant structure. An ion region(390-1) is formed for being overlapped with a source/drain region(270). The third poly layer(410) is formed on the second poly layer. A filling process is carried out on the cell pad contact hole.
|
申请公布号 |
KR20040017476(A) |
申请公布日期 |
2004.02.27 |
申请号 |
KR20020049548 |
申请日期 |
2002.08.21 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JIN, GYO YEONG;OH, YONG CHEOL |
分类号 |
H01L27/108;H01L21/336;H01L21/60;H01L21/768;(IPC1-7):H01L27/108 |
主分类号 |
H01L27/108 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|