| 摘要 |
PROBLEM TO BE SOLVED: To provide a package structure of a semiconductor device and its manufacturing method capable of simply manufacturing a package as well as reducing disconnection of a wiring. SOLUTION: The package structure of the semiconductor device comprises a semiconductor chip 1 having a semiconductor element and an electrode pad 2, and a protection layer 3 having a wiring 5 structuring an electric circuit on one surface and a plurality of interlayer connection bodies 4 penetrated from the specific position to the other surface. The protection layers 3 are laminated on the semiconductor chip 1 to cover an electrode pad 2, a top of the interlayer connection body 4 is connected to the electrode pad 2, and the wiring 5 is arranged on a surface opposite to a surface covering the electrode pad 2 of the protection layer 3. COPYRIGHT: (C)2004,JPO |
