| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet for an inner layer circuit-filled laminate capable of assuring sufficient rigidity even in the inner layer circuit-filled laminate using the adhesive sheet for the inner layer circuit-filled laminate comprising a heat resistant film and a thermosetting resin layer, and to provide an inner layer circuit-filled laminate thereby assuring sufficient rigidity. SOLUTION: In the adhesive sheet for the inner layer circuit-filled laminate having epoxy resin composition layers formed at both sides of the heat resistant film using a polyimide or an aromatic polyamide, an inorganic filling material is blended with the epoxy resin composition layer to enable the rigidity of the inner layer circuit-filled laminate manufactured by using the adhesive sheet to be improved, and simultaneously, its thermal expansion coefficient can be lowered. Further, in the inner layer circuit-filled laminate formed by laminating integrally such an adhesive sheet and an inner layer material having the inner layer circuit forming surface, rigidity of a substrate is improved, and the thermal expansion coefficient can be reduced. COPYRIGHT: (C)2004,JPO |
