发明名称 METHOD OF MANUFACTURING PRINTED WIRING BOARD, METALLIC SHEET FOR PRINTED WIRING BOARD, AND CONNECTED PRINTED WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing printed wiring board by which a printed wiring board containing insulating resin layers having uniform thicknesses and excellent flatness can be obtained while the wiring board maintains ideal sectility in a step of cutting and dividing a connected printed wiring board into individual printed wiring boards. <P>SOLUTION: In this method, a connected wiring board containing a metallic sheet 12 having first and second main surfaces 14 and 15 and insulating resin layers arranged on the main surfaces 14 and 15 is first manufactured. The metallic sheet 12 also has first and second recessed sections 16 and 17. The first recessed sections 16 are opened on the first main surface 14 and noncontinuously arranged along prescribed planned cutting lines 13. The second recessed sections 17 are opened on the second main surface 15 and noncontinuously arranged along prescribed planned cutting lines 13. Then the connected printed wiring board is divided into a plurality of printed wiring boards by cutting the connected printed wiring board along the planned cutting lines 13. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004063803(A) 申请公布日期 2004.02.26
申请号 JP20020220398 申请日期 2002.07.29
申请人 NGK SPARK PLUG CO LTD 发明人 SUZUKI TOMOE;YURI SHINJI;SATO KAZUHISA;YAMAZAKI KOZO
分类号 B32B15/08;B32B27/38;H05K1/05;H05K3/00;H05K3/44;(IPC1-7):H05K3/00 主分类号 B32B15/08
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