| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition apparatus for preventing warping of a tray to hold a substrate to be treated or heat radiation from the substrate to the tray and ensuring the temperature uniformity on the substrate in a process for sputtering a ferroelectric film or the like while maintaining the heat uniformity of 600°C±5°C. SOLUTION: For a mechanism for holding a substrate subjected to high-temperature film deposition, the substrate 1 is held on a tray 3 by a pin 2, slit is performed on the tray 3, and a shock-absorbing material 39 is thermally-sprayed on the rear face of the tray 3 to improve the temperature uniformity of the surface of the substrate 1. COPYRIGHT: (C)2004,JPO |
