| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermocompression bonding device capable of increasing heat transfer from a heater to the thermocompression part to decrease power consumption. SOLUTION: The thermocompression bonding device comprises a receptacle mount stand 3 on which a substrate 2 is mounted, a thermocompression bonding tool for compression bonding electronic components 1 to the substrate 2 mounted on the stand 3, a heater 8a for heating the tool, and a thermal insulation member 16 arranged for covering a part of or whole surface of the themocompression bonding tool. A mica-glass connection, a plate member with its surface mirror polished or the like are used as the thermal insulation member 16. COPYRIGHT: (C)2004,JPO
|
