发明名称 SEMICONDUCTOR MEMORY DEVICE AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To prevent the refreshing characteristics deteriorated by the influence of adjacent word lines of adjacent cells and to enable to reduce defects a after packaging and reflowing. <P>SOLUTION: An active region 1 has a diffused layer in a region sandwiched between word lines 4, 2, 3 and 5. The diffused layer 6 sandwiched between the word lines 2 and 3 is connected to a bit line via a contact, and a diffused layer 7 sandwiched between the word lines 2 and 4 and a diffused layer 8 sandwiched between the word lines 3 and 5 are connected to respective capacities through a contact. A cell structure has two cell transistors in which the word line 2 is used as a gate electrode, and the diffused layers 6, 7 are used as source/drain. In the structure, the word line 3 is used as a gate electrode, and the diffused layers 6, 8 are used as source/drain. N-type diffused layers 7, 8 formed of the word lines 2, 3 adjacent to the word lines 4, 5 have a high n-type carrier concentration at the word lines 4, 5 sides from the word lines 2, 3 sides, or a p-type substrate concentration is set to a low concentration at the word lines 4, 5 sides. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004063527(A) 申请公布日期 2004.02.26
申请号 JP20020216112 申请日期 2002.07.25
申请人 ELPIDA MEMORY INC;HITACHI ULSI SYSTEMS CO LTD;HITACHI LTD 发明人 OYU SHIZUNORI;OGISHIMA JUNJI;UCHIYAMA HIROYUKI;KAWAKITA KEIZO;SUZUKI MASATO
分类号 H01L21/76;H01L21/265;H01L21/336;H01L21/762;H01L21/8234;H01L21/8242;H01L27/108 主分类号 H01L21/76
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