| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component-packaging apparatus and a component-packaging method, in which the production efficiency of substrates is improved. <P>SOLUTION: An electronic component packaging apparatus 100 is provided with a head unit 1, having a plurality of nozzles 111 for respectively adsorbing electronic components 4 indicated, a line scan camera 13 which moves once to pick up images of the plurality of electronic components, and a packaging order determining means (control part 3, for example) for determining the order of packaging the plurality of components, chucked simultaneously by the plurality of nozzles onto a circuit board 5. In the packaging order determining means, among all the combination of packaging orders of the plurality of components chucked simultaneously by the plurality of nozzles onto the board, the combination of packaging orders, in which all of the times required for packaging the plurality of components becoms the shortest as a whole is determined, based on the time required for a component-recognizing means (control part 3, for example) for recognizing the components. <P>COPYRIGHT: (C)2004,JPO |
