发明名称 |
Surface mount interconnect and device including same |
摘要 |
A surface mount interconnect is disclosed. The interconnect includes a solid conductor having a first section, a second section, and a central section between the first and second sections. The first section includes at least one curved surface, and the second section includes at least one curved surface. The central section includes first and second planar surfaces.
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申请公布号 |
US2004038559(A1) |
申请公布日期 |
2004.02.26 |
申请号 |
US20020226830 |
申请日期 |
2002.08.23 |
申请人 |
FLANNERY JOHN;GRAY MICHAEL |
发明人 |
FLANNERY JOHN;GRAY MICHAEL |
分类号 |
H01R12/57;H05K3/36;(IPC1-7):H01R12/00 |
主分类号 |
H01R12/57 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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