| 摘要 |
PROBLEM TO BE SOLVED: To reduce the cost of a multilayered printed wiring board as a whole by reducing the number of required metal masks in the stage of a pilt manufacturing or at the time of small-lot production. SOLUTION: In a method of manufacturing multilayered printed wiring board, a multilayered printed wiring board is manufactured by forming a printed wiring board by forming a wiring pattern on a core substrate having a wiring pattern on its surface, by performing interlayer connection by pressing conductive foil with bumps obtained by printing conductive bumps on conductive foil by using a metal mask against the substrate through an insulating layer, while the foil is heated and processing the conductive foil on the external surface of the substrate. Then a multilayered printed wiring board is manufactured by laminating a plurality of printed wiring boards manufactured in the above-mentioned way upon another. The interlayer connection is performed more than twice the number of metal masks by forming reference patterns in which different interlayer connection patterns are arranged in areas formed by dividing the metallic mask into a plurality of areas, and laminating the printed wiring boards upon another by combining the reference patterns with the rotated patterns and/or inverted patterns of the reference patterns. COPYRIGHT: (C)2004,JPO |
