| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state image sensing device which is provided with joints that are superior in bonding properties and high in reliability. SOLUTION: The solid-state image sensing device is equipped with a semiconductor substrate 101 where a solid-state image sensing element is formed, and a transparent member 201 which is connected to the semiconductor substrate 101 through the intermediary of a spacer so as to confront the light receiving region of the solid-state image sensing element through a space. At the joint, at least one of two planes bearing against each other is provided with a recess. COPYRIGHT: (C)2004,JPO
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