| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a means for permitting easily and surely mounting an insertion mount semiconductor device on an external substrate or the like by soldering. <P>SOLUTION: In the semiconductor device 1, semiconductor elements 2, 3 are mounted on a lead frame 5 equipped with lead wires 4. The semiconductor elements 2, 3 are connected to the leads 4 by metallic fine wires 6, 7. The semiconductor device 1 is also equipped with a heat sink 8. Respective members 2-8 are sealed with a plastic package 10. The leads 4 are exposed to the outside of the plastic package. The terminal leads 4a-4d are provided with a wide first lead unit, a narrow second lead unit, a third lead unit inserted into the external substrate, and a projected gap regulating unit 9 for keeping a gap between the semiconductor device 1 and the external substrate in constant. The temperature raising property of the lead is improved by the increase of a thermal resistance of a heat dissipating route from the leads 4 toward the plastic package 10 whereby soldering property is improved. <P>COPYRIGHT: (C)2004,JPO |
