| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve such problems that the wide section of a high-frequency signal pad becomes a tip open stub in measurement using a high-frequency prober, and characteristics in the high-frequency signal pad are deteriorated by the mismatch of impedance with a wire in packaging, in the conventional MMIC or dielectric substrate. <P>SOLUTION: The high-frequency signal pad of the MMIC or dielectric substrate is set to be nearly the same width as measurement impedance, and a connection auxiliary pad that is not connected to neither is provided between GND pads. Additionally, in packaging, the GND pads and connection auxiliary pads are connected in addition to the high-frequency signal pads so that the crushed portion of the wire comes into contact with both the GND and connection auxiliary pads. <P>COPYRIGHT: (C)2004,JPO |
