| 摘要 |
A radiating structure of an electronic circuit unit comprising a circuit board, on which a plurality of circuit parts including a heater element are mounted, and a radiating plate of an aluminum material supporting the circuit board, the circuit board and the radiating plate being beforehand fixed together by the eyelets or the like, in which state cream solder is applied on predetermined portions of the circuit board to make reflow solder, thereby filling solder into through-holes provided in the circuit board to bring the circuit board into contact with the radiating plate. When the radiating structure thus constructed is adopted, the solder filled into the through-holes heightens degree of adhesion between the circuit board and the radiating plate, so that heat of the heater element can be efficiently radiated outside through the radiating plate from the circuit board.
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