| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide the manufacture of a chip array type ball grid array package for a substrate on chip. <P>SOLUTION: One piece of chip is attached to the first surface of respective substrate units of a substrate, and the front surface of the chip is bonded to the first surface to make the unit area of substrate of a matrix array smaller than the area of the chip. Then, a plurality of lead wires are connected from the front surface of the chip to the second surface of the substrate unit through wire bonding. Further, the lead wires and the front surface of the chip are covered and protected by sealing resin, and a plurality of solder balls are formed on the second surface of a substrate unit between the lead wires. A package structure after finishing the dicing coincides with the demand of an actual chip size package and increases productivity whereby reliability is improved and a manufacturing cost is reduced. <P>COPYRIGHT: (C)2004,JPO |
