| 摘要 |
A heat dissipation system includes an enclosure (10), a motherboard (30), a CPU module, a plurality of first system fan (80) and a second fan (90). The enclosure includes a first panel (12), a second panel (14) perpendicular to the first panel and a third panel (16) parallel to the first panel. A plurality of air inlets (18) is defined in the third panel. The motherboard is mounted inside the enclosure parallel to but opposite from the second panel. The CPU module is secured to the motherboard. The first fan is secured to the first panel for expelling air inside the enclosure to an outside of the enclosure. The second fan is secured to the second panel for causing air entering the enclosure via the air inlets to be directed generally toward the CPU module.
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