Heat dissipation tower for circuit devices

摘要

A heat transfer device such as a heat sink has one or more heat pipe tubes mounted in a base plate. The heat pipe tubes have a working fluid in a vessel with a wicking material between an evaporator and condenser. The heat pipe traverses a through opening in the base plate and extends along a receptacle in the base plate facing the heat source, this portion preferably defining the heat pipe evaporator. The heat pipe has legs extending perpendicularly from the base plate, and preferably hold spaced heat transfer fins, the legs forming the condenser part of a stacked tower of fins on the base plate. Preferably two or more heat pipes are provided in the form of U-shaped or L-shaped tubes that are flattened along the underside of the base plate to bear against the heat source.