发明名称 INDUCTION BONDABLE HIGH-PRESSURE LAMINATE
摘要 <p>The present invention relates to novel high-pressure laminate constructions that can be bonded to a substrate through the use of electromagnetic energy. Specifically, high-pressure laminates are made which incorporate or have bonded thereto a susceptor element which absorbs electromagnetic energy, generating heat sufficient to melt or activate an intermediate adhesive for bonding the laminate to a substrate. In a preferred embodiment, the high-pressure laminates have a pre-applied heat sensitive adhesive.</p>
申请公布号 AU2003265322(A1) 申请公布日期 2004.02.25
申请号 AU20030265322 申请日期 2003.07.30
申请人 NEXICOR LLC 发明人 MARK, R. HOLZER;PHILIP, L. KROPP;EDWARD, K., II WELCH
分类号 B29C35/02;B29C35/08;B32B27/42;B32B29/02;H05B6/02;(IPC1-7):C09J5/02;B32B27/08;B32B7/12;B32B31/26;B32B21/08 主分类号 B29C35/02
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