发明名称 |
INDUCTION BONDABLE HIGH-PRESSURE LAMINATE |
摘要 |
<p>The present invention relates to novel high-pressure laminate constructions that can be bonded to a substrate through the use of electromagnetic energy. Specifically, high-pressure laminates are made which incorporate or have bonded thereto a susceptor element which absorbs electromagnetic energy, generating heat sufficient to melt or activate an intermediate adhesive for bonding the laminate to a substrate. In a preferred embodiment, the high-pressure laminates have a pre-applied heat sensitive adhesive.</p> |
申请公布号 |
AU2003265322(A1) |
申请公布日期 |
2004.02.25 |
申请号 |
AU20030265322 |
申请日期 |
2003.07.30 |
申请人 |
NEXICOR LLC |
发明人 |
MARK, R. HOLZER;PHILIP, L. KROPP;EDWARD, K., II WELCH |
分类号 |
B29C35/02;B29C35/08;B32B27/42;B32B29/02;H05B6/02;(IPC1-7):C09J5/02;B32B27/08;B32B7/12;B32B31/26;B32B21/08 |
主分类号 |
B29C35/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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