| 摘要 |
PROBLEM TO BE SOLVED: To surely prevent resin liquid from flowing to the rear surface of a semiconductor wafer, reduce the residues of the resin liquid, and which shorten the time required for cleaning and removing the residues of the resin liquid. SOLUTION: The resin liquid is sprayed on the semiconductor wafer 11 from the exhaust nozzles of a line nozzle 3, as the line nozzle 3 is moved, whereby a resin film 12 nearly uniform in thickness is formed on the surface of the semiconductor wafer 11. At this point, an excessive resin liquid is sprayed outside of the semiconductor wafer 11, but a second suction pump 6 surely sucks in the excessive resin liquid through an annular suction path 2b from the annular region 1b of a wafer stage 1, with a suction pressure vb that is set sufficiently high. Therefore, the resin liquid is sucked in through the wafer stage 1, before the resin liquid penetrates into the gap between the rear surface of the semiconductor wafer 11 and the wafer stage 1, so that the resin liquid is restrained from entering to the rear surface of the semiconductor wafer 11. The resin liquid is hardly left on the wafer stage 1. COPYRIGHT: (C)2004,JPO
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