| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem wherein, when a package for high frequency is mounted on a circuit, high-frequency mismatching occurs and the losses of high-frequency input-output signals increase and, consequently VSWR is deteriorated, because the capacitance component generated between a dielectric substrate of the package and the circuit board increases. SOLUTION: The package for high frequency is provided with the dielectric substrate 21 on the upper surface of which the mounting section of a high-frequency circuit component S is formed, a first line conductor 22 for transmitting high-frequency signals and a first grounding conductor 23 both of which are formed to be flush with on the upper surface of the substrate 21, and a second line conductor 24 and a second grounding conductor 25 both of which are formed to be flush on the lower surface of the substrate 21. The package is also provided with a through-conductor 26, which connects the end sections of the first and second line conductors 22 and 24 to each other and a grounding through-conductor 27, which connects the flush grounding conductors 23 and 25 to each other and a metallic terminal 32 joined to the second line conductor 24 and a grounding metal terminal 34 joined to the second flush grounding conductor 25. The frequencies of the high-frequency signals are≥5 GHz and the width of the metallic terminal 32 is adjusted to be 0.05-1.2 mm. COPYRIGHT: (C)2004,JPO |
