Aluminum/copper clad interconnect layer for VLSI applications

摘要

A method of forming at least one aluminum/copper clad interconnect comprising the following steps. A substrate is provided having an overlying patterned dielectric layer. The patterned dielectric layer having at least one lower opening. The at least one lower opening is lined with a first barrier layer. At least one planarized copper portion is formed within the at least one first barrier layer lined lower opening. A patterned layer is formed over the at least one planarized copper portion and the patterned dielectric layer. The patterned layer has at least one upper opening exposing at least a portion of the at least one planarized copper portion. The at least one upper opening is lined with a second barrier layer. At least one aluminum portion is formed within the at least one second barrier layer lined opening to form the at least one aluminum/copper clad interconnect.