| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a CMP device capable of accurately detecting a grinding end point even when the transparency of the transparent film of a laser window is deteriorated, a CMP grinding method, a semiconductor device and a method for manufacturing the semiconductor device. <P>SOLUTION: In this CMP grinding method, the surface of a reference unit is irradiated with a laser beam 34 emitted by a light emitting element 32 through the transparent film of a laser window 30, lights reflected on the surface are received by the light receiving element through the transparent film of the laser window 30, and the strength of the received lights is compared with the initial strength of the reflected lights of the reference unit preliminarily measured before the transparency of the transparent film of the laser window is deteriorated. When the strength of the received lights is deteriorated against the initial strength, the strength of the laser beam 34 emitted by the light emitting element 32 is set so as to be high only by the deterioration rate, and the laser beam 34 is emitted by the light emitting element 32 according to the setting. Then, the grinding end point of a substrate 14 to be ground is detected, and the grinding of the substrate 14 to be ground is ended at the end point of grinding. <P>COPYRIGHT: (C)2004,JPO |
