| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic package structure having a module arrangement and its forming method. <P>SOLUTION: This electronic package structure reduces stress which occurs at a chip 12, an underfill 18, a ball grid array connection, and a flexible substrate 14 made of an organic material. The stress causes potential delamination problems due to thermally induced warpage among components in a module structure. By reducing the stress, no warpage occurs among components in the electronic package, resulting in no delamination problems. <P>COPYRIGHT: (C)2004,JPO |
