发明名称 |
THIN FILM CAPACITOR, COMBINED PASSIVE COMPONENT INCLUDING THE THIN FILM CAPACITOR, METHOD OF MANUFACTURING SAME, AND WIRING BOARD INCLUDING SAME |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent a dielectric thin film from being broken by stress caused by the dielectric thin film even when the dielectric thin film is formed at a high temperature than the cure temperature of a flexible base material. <P>SOLUTION: A thin film capacitor has a lower electrode 5, a dielectric thin film 8, and an upper electrode 9 that are laminated on a flexible base material 1, wherein the lower electrode 5 has a contact electrode 2 being contact with the insulating base material, an oxidation resistant electrode 4 being contact with the dielectric thin film, and a high elasticity electrode 3 which is provided between the contact electrode 2 and the oxidation resistant electrode 4 and has a higher Young's modulus than the oxidation resistant electrode. The high elasticity electrode 3 is 400 nm or larger in thickness. <P>COPYRIGHT: (C)2004,JPO</p> |
申请公布号 |
JP2004056097(A) |
申请公布日期 |
2004.02.19 |
申请号 |
JP20030136846 |
申请日期 |
2003.05.15 |
申请人 |
NEC CORP |
发明人 |
MORI TORU;SHIBUYA AKINOBU;YAMAMICHI SHINTARO |
分类号 |
H01G4/33;H01G4/40;H05K3/46;(IPC1-7):H01G4/33 |
主分类号 |
H01G4/33 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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