ADHESIVE RESIN COMPOSITION AND FILM ADHESIVE USING IT

摘要

PROBLEM TO BE SOLVED: To provide a polyimide-based adhesive resin composition which is excellent in low temperature adhesion, heat resistance and low moisture absorption and also in hygroscopic reflow resistance; a film adhesive comprising the above resin composition which is suitable for sticking a semiconductor element to a substrate; and a semiconductor device which uses the above adhesive. SOLUTION: The adhesive resin composition comprises (A) a polyimide-based resin obtained by reacting a diamine component comprising an aromatic diamine expressed by formula (1) and a specific silicone-based diamine with a tetracarboxylic acid dianhydride and (B) a thermosetting resin. The thermosetting resin is preferably an epoxy resin. COPYRIGHT: (C)2004,JPO