发明名称 CONDUCTIVE PATTERN MATERIAL, METAL PARTICULATE PATTERN MATERIAL, AND PATTERN FORMATION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a conductive pattern material of high conductivity and wide application, a metal particulate pattern material, having a metal particulate absorption region of superior durability, into which metal particulates are dispersed in high concentration, and to provide a pattern formation method by which they are manufactured in a simple process of high productivity. SOLUTION: After a pattern comprising hydrophilic/hydrophobic regions is formed on a surface of a substrate, metal ions or metal salt is added to the hydrophilic region. Then the metal ion or that in the metal salt is reduced to form a metal thin film or the metal particulate absorption region, thereby the conductive pattern material or the metal particulate pattern material is constituted. The pattern formation method comprises a step for forming the pattern comprising the hydrophilic/hydrophobic regions on the surface of the substrate; a step for adding the metal ion or the metal salt to the formed hydrophilic region; and a step for reducing the metal ion or that in the metal salt and then depositing a metal to form a metal (particulate) film pattern. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004056106(A) 申请公布日期 2004.02.19
申请号 JP20030146125 申请日期 2003.05.23
申请人 FUJI PHOTO FILM CO LTD 发明人 KANO TAKEYOSHI;KAWAMURA KOICHI
分类号 G03F7/40;G03F7/20;H05K3/10;(IPC1-7):H05K3/10 主分类号 G03F7/40
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