SURFACE MICROMACHINED PROCESS FOR MANUFACTURING ELECTROACOUSTIC TRANSDUCERS

摘要

This invention relates to a surface micromachining process for manufacturing Electro-acoustic transducers, particularly ultrasonic transducers, said transducers comprising a silicon semiconductor substrate (1), on an upper surface of which one or more membranes (18) of resilient materials are supported by a structural layer (11) of insulating materiel, rigidly connected to said semiconductor substrate (1), said resilient material having a Young's modulus not lower than 50 GPa, said membranes (18) being metallised, said transducers including one or more lower electrodes (23, 25), rigidly connected to said semiconductor substrate (1), the process being characterised in that said structural layer (11) includes silicon monoxide. The invention further relates to an Electro-acoustic transducer, particularly an ultrasonic transducer, characterised in that the insulating material of the structural layer (11) is silicon monoxide. The invention also relates to an intermediate product for utilisation in said process for realising Electro-acoustic transducers, particularly ultrasonic transducers.