MULTILAYER PRINTED WIRING BOARD

摘要

A package board that causes neither a malfunction nor an error in an IC chip of a high-frequency region of particularly over 3GHz. A conductor layer (34P) on a core board (30) is formed to have a thickness of 30 mum, and a conductor circuit (58) on an interlayer insulation layer (50) a thickness of 15 mum. Thickening the conductor layer (34P) enables an increase in the volume of the conductor itself and a decrease in its resistance. Further, the use of the conductor layer (34) as a power source layer enables an improvement in the capability of power supply to the IC chip.