发明名称 Semiconductor device formed in a semiconductor layer provided on an insulating film
摘要 A semiconductor device includes an insulating film provided on a semiconductor substrate and a semiconductor layer provided on the insulating film. An element separating insulating film separates element area. A first gate insulating film is provided on the semiconductor layer in the element area. A gate electrode is provided on the first gate insulating film. Source/drain diffusion layers are formed in the semiconductor layer sandwiching a channel area under the gate electrode therebetween. A potential applying section inducing a leak current which controls the potential of the semiconductor layer comprises a second gate insulating film provided on the semiconductor layer in the element area and a conductive film provided on the second gate insulating film and connected to the gate electrode. The potential applying section is configured so that a leak current through the second gate insulating film is larger than a leak current through the first gate insulating film.
申请公布号 US6693328(B1) 申请公布日期 2004.02.17
申请号 US20020303546 申请日期 2002.11.25
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 KAWANAKA SHIGERU;NII HIDEAKI
分类号 H01L21/336;H01L27/12;H01L29/423;H01L29/49;H01L29/786;(IPC1-7):H01L27/12 主分类号 H01L21/336
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