发明名称 |
Semiconductor device formed in a semiconductor layer provided on an insulating film |
摘要 |
A semiconductor device includes an insulating film provided on a semiconductor substrate and a semiconductor layer provided on the insulating film. An element separating insulating film separates element area. A first gate insulating film is provided on the semiconductor layer in the element area. A gate electrode is provided on the first gate insulating film. Source/drain diffusion layers are formed in the semiconductor layer sandwiching a channel area under the gate electrode therebetween. A potential applying section inducing a leak current which controls the potential of the semiconductor layer comprises a second gate insulating film provided on the semiconductor layer in the element area and a conductive film provided on the second gate insulating film and connected to the gate electrode. The potential applying section is configured so that a leak current through the second gate insulating film is larger than a leak current through the first gate insulating film.
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申请公布号 |
US6693328(B1) |
申请公布日期 |
2004.02.17 |
申请号 |
US20020303546 |
申请日期 |
2002.11.25 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
KAWANAKA SHIGERU;NII HIDEAKI |
分类号 |
H01L21/336;H01L27/12;H01L29/423;H01L29/49;H01L29/786;(IPC1-7):H01L27/12 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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