CIRCUIT DEVICE AND ITS PRODUCING METHOD

摘要

PURPOSE: To prevent outflow of a brazing material 19 from a die pad 11 by forming a second plating film 14B on the surface of the die pad 11. CONSTITUTION: The second plating film 14B is provided in the peripheral part on the surface of the die pad 11 to surround a region for mounting a semiconductor device 13. In the production process for mounting the semiconductor device 13 through the brazing material 19, the brazing material 19 flows out from a first plating film 14A when the semiconductor device 13 is mounted on the fused brazing material 19, but the second plating film 14B functions as a region for preventing outflow. Consequently, short circuit of the die pad 11 and a bonding pad 12 due to spread brazing material 19 can be prevented.