发明名称 Technique for surface mounting electrical components to a circuit board
摘要 A technique for mounting an electrical component to a circuit board includes deforming each of a number of electrical terminals extending from the electrical component to form a mounting portion and a tip portion extending away from the mounting portion. The circuit board defines a number of bores extending therein from a first surface to a second opposite surface, and the electrical component is mounted to the circuit board with the mounting portion of each of the number of electrical terminals supporting the component against the first surface of the circuit board with each of the tip portions extending into separate ones of the number of bores. The mounting portion of each of the electrical terminals is mechanically and electrically affixed to corresponding electrically conductive pads to thereby surface mount the electrical component to the circuit board. The disclosed technique is particularly advantageous for surface mounting display units.
申请公布号 US2004027810(A1) 申请公布日期 2004.02.12
申请号 US20030628823 申请日期 2003.07.28
申请人 DELPHI TECHNOLOGIES, INC. 发明人 PHALEN MICHAEL DENNIS
分类号 H05K3/30;(IPC1-7):H05K1/00 主分类号 H05K3/30
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