FLUX FOR SOLDERING, AND ELECTRONIC CIRCUIT

摘要

PROBLEM TO BE SOLVED: To restrain the diffusion of nickel into molten solder alloy when the soldering is performed, to improve the joined strength of the soldering by preventing the concentration increase of phosphorus and to restrain the reduction-precipitation of silver and/or copper into a part except an circuit pattern. SOLUTION: In a flux used when the soldering is performed in the circuit applied to a non-electrolytic nickel plating or further applying a gold-plating on the non-electrolytic nickel plating, one or more kinds of complexes of the silver ion and/or the copper ion are contained in this flux. COPYRIGHT: (C)2004,JPO