ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE FABRICATION AND FOREIGN MATTER REMOVAL METHOD

摘要

PROBLEM TO BE SOLVED: To lessen the amount of foreign substances in a part in the inside of a semiconductor device fabrication apparatus by sticking and removing the foreign substances sticking to the surface of the part in the inside of the semiconductor device fabrication apparatus by an adhesive sheet for the semiconductor device fabrication apparatus and at the same time preventing static electricity generated when releasing the sheet. SOLUTION: The adhesive sheet for the semiconductor device fabrication apparatus to be stuck to a part in the inside of the semiconductor device fabrication apparatus is made to form a conductor couple so as to suppress static electricity generation at the time of releasing the sheet from the part. Consequently, no foreign substance is attracted by Coulomb force attributed to the static electricity and the quantity of the foreign substance sticking to the surface of the part in the inside of the semiconductor device fabrication apparatus can be decreased. COPYRIGHT: (C)2004,JPO