发明名称 COOLING MECHANISM OF INFORMATION PROCESSOR
摘要 <p><P>PROBLEM TO BE SOLVED: To reduce the size of an information processor and reduce noise from the processor by suppressing a temperature rise in a housing of the information processor and overheat of a power supply unit due to mounting a high-heat generation processor. <P>SOLUTION: The heat generation 32 of the processor is discharged outside, and also the heat 33 is discharged outside the housing by a fan 11b which is mounted on the power supply unit 11 to discharge the heat. In this case, since the generating heat 32 of the processor does not pass through a high-heat generating part 11c of the power supply unit, the overheat of the power supply unit can be suppressed. Since the fan 11b for discharging the heat can stop when the processor is hardly heated, the noise can be suppressed to the minimum. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004047751(A) 申请公布日期 2004.02.12
申请号 JP20020203455 申请日期 2002.07.12
申请人 HITACHI LTD 发明人 OIKAWA HIRONORI;TOIZONO TAKESHI
分类号 G06F1/20;H01L23/467;H05K7/20;(IPC1-7):H05K7/20 主分类号 G06F1/20
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