发明名称 RUNNER-LESS MOLDING APPARATUS FOR THERMOSETTING RESIN, RUBBER AND THE LIKE
摘要 PROBLEM TO BE SOLVED: To afford an improved moldability and a load mitigation on global environment with reductions in a fabrication cost and industrial waste as well as material loss eradication of sprue runners, which are achieved by long distance separation from a gate so as to prevent high molding temperature of a cavity from conducting into a runner member and give the runner uniform temperature distribution during molding. SOLUTION: In a runner-less molding apparatus for a thermosetting resin, a rubber and the like, a movable runner bushing 15, which can circulate an uncured, unvulcanized and low temperature fluidized raw material supplied from an infusion nozzle 31, is slidably arranged into a temperature adjustment bushing 13 leading to a gate 4 of a cavity 1. During heat-treatment, a thermal insulating empty space A is formed by separating the distance between above-mentioned runner bushing 15 and the gate 4 and, a valve pin 18 is allowed to open and close the gate 4 in connection with a spouting operation by inserting the valve pin 18 with removability in the runner bushing 15. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004042662(A) 申请公布日期 2004.02.12
申请号 JP20030330027 申请日期 2003.09.22
申请人 SEIKI CORP 发明人 TANAKA YOSHITERU;YOSHIDA MASAAKI
分类号 B29C45/27;(IPC1-7):B29C45/27 主分类号 B29C45/27
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