摘要 |
PROBLEM TO BE SOLVED: To provide a tape for connecting substrates, which has such a strength as not to cause separation between the substrates at the part to be etched, when connected several substrates are etched during being transported, and thereby to cope with a phenomenon of causing a nonuniform etching in a transportation direction on the top faces of the several substrates. SOLUTION: In a method for etching the several substrates horizontally transported by a transportation means, this etching method connects each other edge in the transportation direction of each adjacent substrate, with a tape for connecting the substrates, which is a laminate comprising at least (A) a layer dissolvable into an etchant, (B) a layer which dissolves at least in a resist-removing liquid and has etching resistance, and (C) a layer which dissolves at least in the resist-removing liquid and has stickiness. COPYRIGHT: (C)2004,JPO
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