| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a liquid cooling structure wherein it assures a circulated fluid flow rate necessary and sufficient for an increase in the quantity of heat generation of a heating device followed by an improvement in the throughput capacity of electronic equipment, and is suitable for being reduced in size and thickness, and further provide the electronic equipment durable for a long-term use. <P>SOLUTION: The electronic equipment is adapted such that it thermally connects a heat receiving jacket 4 to a heating device 3, and further thermally connects a tank 5, a pipe 6, a pipe 7, and a heat sink panel 25 all disposed on the back of a display 2. A refrigerant fluid is circulated between the heat receiving jacket 4 and a pipe 9 with the aid of a pump 8. Moreover, a metal heat sink panel is covered with a resin display cover. <P>COPYRIGHT: (C)2004,JPO</p> |
