| 发明名称 |
SEMICONDUCTOR PACKAGE AND ITS MANUFACTURING METHOD |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent fused solder from flowing to an adjacent solder bump when a solder bump is fused on a gap formed between a resin and an insulation film or between a resin and a solder resist, in a semiconductor package. <P>SOLUTION: Circular grooves 21 for preventing the fused solder from flowing from one solder bump 14 to the adjacent solder bump 14 passing through the gap between the insulation film 13 and the resin 19 are provided so that the grooves 21 surround axes of the solder bumps 14 on an insulation film 13. <P>COPYRIGHT: (C)2004,JPO</p> |
| 申请公布号 |
JP2004047637(A) |
申请公布日期 |
2004.02.12 |
| 申请号 |
JP20020201595 |
申请日期 |
2002.07.10 |
| 申请人 |
RENESAS TECHNOLOGY CORP |
发明人 |
HIYOUZOU MASAHIKO;SAWADA KEIICHI;IMAMURA MASABUMI |
| 分类号 |
H01L23/12;H01L21/60;(IPC1-7):H01L23/12 |
主分类号 |
H01L23/12 |
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