| 摘要 |
PROBLEM TO BE SOLVED: To provide a hybrid integrated circuit device 10 which is equipped with a heat sink 13 that can be improved in heat sink capacity. SOLUTION: The hybrid integrated circuit device 10 is composed of a rectangular board 11, a conductive pattern 12 formed on the surface of the board 11, and a circuit element 14 mounted at a prescribed position on the conductive pattern 12. Furthermore, a power semiconductor element 14A is mounted on the conductive pattern 12 through the heat sink 13. A recess 16 is formed at the top surface of the heat sink 13. The power semiconductor element 14A is mounted on the surface of solder 17 provided in the recess 16. COPYRIGHT: (C)2004,JPO |
