Low temperature method for forming a microcavity on a substrate and article having same

摘要

A low temperature method for forming a microcavity on a substrate and article having same are provided which utilize electroplated films. The method is particularly useful to package microelectromechanical systems (MEMS) in vacuum on the wafer level and provide sealed feedthroughs to the outside world. The method may be performed in a batch process to substantially reduce cost and to form metal diaphragms. Furthermore, the method is performed at near room temperature, which provides more flexibility in the manufacturing process. The method enables substantial cost savings in the production of vacuum-sealed MEMS. Many feedthroughs can be incorporated into the package to transfer signals in and out of the package. One significant advantage of this method is that it does not require bonding of a second substrate, which reduces the system cost.