| 摘要 |
PROBLEM TO BE SOLVED: To provide a 6-axis inner force sense sensor which enables the miniaturization of a chip, high sensitivity and reduction in consumption power. SOLUTION: The sensor is provided with a sensor footing 3 whose outer end portion is fixed on a pedestal 2, a force operating part 4 which is arranged in the almost central part of the sensor footing and to which force is applied from the outside, a strain gauge 5 which is arranged on the sensor footing and detects distortion generated in the sensor footing, and a bridge circuit for measuring resistance change of the strain gauge. The force applied to the force operating part is divided into six axial forces and detected. Three out of the six forces are in first and second axis directions which are mutually perpendicular on a sensor footing upper surface, and in a third axis direction perpendicular to the sensor footing, Residual three forces are forces and moments around the respective axes. An upper surface of the sensor footing is constituted of a crystal surface of silicon semiconductor whose face orientation is (111). COPYRIGHT: (C)2004,JPO
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