发明名称 |
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits |
摘要 |
A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.
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申请公布号 |
US2004026486(A1) |
申请公布日期 |
2004.02.12 |
申请号 |
US20030616078 |
申请日期 |
2003.07.07 |
申请人 |
EVERS SVEN;CLYNE CRAIG T. |
发明人 |
EVERS SVEN;CLYNE CRAIG T. |
分类号 |
B23K20/00;H01L21/00;H01L21/687;(IPC1-7):B23K37/00 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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