METHOD FOR MANUFACTURING BOARD WITH BUILT-IN DEVICE AND BOARD WITH BUILT-IN DEVICE, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD

摘要

A method for manufacturing a board with a built-in device in which a conductor pattern of a fine pitch can be precisely formed on an insulating layer while ensuring a dimension stability of the conductor pattern and a transfer sheet can be adequately removed, a board with a built-in device, a method for manufacturing a printed wiring board, and a printed wiring board are disclosed. A transfer sheet (61) comprises a metal base layer (62) and a metal-to-be-melted layer (64). A conductor pattern (55) is formed on the metal-to-be-melted layer (64) by electroplating. After the transfer sheet (61) with the formed conductor pattern (55) is bonded to an insulating base (51), the transfer sheet (61) is removed through the steps of separating the metal base layer (62) from the metal-to-be-melted layer (64) and selectively melting and removing the metal-to-be-melted layer (64) with respect to the conductor pattern (55).