| 摘要 |
The invention relates to a plastic package (14) with a plurality of semiconductor chips (3) and also a wiring board (11), on which the semiconductor chips (3) are arranged, and to an injection mold for producing the plastic package (14) and also to an electronic component which can be produced with the aid of the combination of the injection mold, wiring board (11) and plastic package (14). Furthermore, the invention relates to a method which, using the wiring board (11) according to the invention and the two-part injection mold, makes it possible to produce a plastic package (14) of this type with a plurality of semiconductor chips (3) for a plurality of electronic components. |
