| 摘要 |
PURPOSE: A film sticking device and a film sticking method are provided to prevent completely the entry of resin in a process for sealing the resin by sticking evenly a film in an integrated manner on an underside of a semiconductor device. CONSTITUTION: A film sticking device includes an upper clamp block and a lower clamp block. The upper clamp block(25) includes a concave portion(25a) on a lower surface. The concave portion does not interfere with a semiconductor chip, a wire, and so on. The lower clamp block(21) includes air intakes(22,23) on a loading surface for loading a film(30). Further, the outer periphery of a substrate(31) is clamped by the lower clamp block and the upper clamp block and air reflux from the air intakes can be changed from negative pressure to positive pressure.
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