发明名称 CONDUCTIVE CONTACT
摘要 In the electroconductive contact unit of the present invention, a gold plated layer 8 is formed over the surface of an electroconductive needle member 2 via a Ni under layer 7 a, and a layer of iridium (titanium nitride, rhodium or hafnium nitride) is formed on the gold plated layer 8 of the needle portion 2 a by sputtering, via an Ni under layer 7 b. Thereby, the tip portion is provided with an improved resistance to oxidization and wear without using any special material for the needle member, and the durability of the needle member is improved so that the running cost can be minimized.
申请公布号 KR20040013010(A) 申请公布日期 2004.02.11
申请号 KR20037017234 申请日期 2003.12.30
申请人 发明人
分类号 H01R13/15;C23C28/00;C23C28/02;G01R1/067;G01R3/00;H01R13/03;H01R13/24 主分类号 H01R13/15
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