发明名称 |
METHOD FOR PRODUCING AN ELECTRONIC COMPONENT, ESPECIALLY A MEMORY CHIP |
摘要 |
A method for producing an electronic component, especially a memory chip, using a laser-induced correction to equalize an integrated circuit by means of at least one laser via in a layer at least partially covering the circuit. The component comprises a rewiring of the contact pads. The inventive method comprises the following steps: each laser via is closed by means of a separate covering layer which is to be applied locally; a rewiring extending between the local covering layers is created; the local covering layers are removed; and the laser-induced correction is carried out by means of the open laser vias. |
申请公布号 |
EP1388168(A2) |
申请公布日期 |
2004.02.11 |
申请号 |
EP20020740593 |
申请日期 |
2002.05.13 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
HEDLER, HARRY;IRSIGLER, ROLAND;VASQUEZ, BARBARA |
分类号 |
H01L21/66;H01L23/525;(IPC1-7):H01L21/768;H01L23/485;H01L21/60 |
主分类号 |
H01L21/66 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|