WAFER CENTERING METHOD OF SEMICONDUCTOR FABRICATING APPARATUS USING JIG WAFER

摘要

PURPOSE: A wafer centering method of a semiconductor fabricating apparatus using a jig wafer is provided to reduce variation of an interval of wafer centering time of each semiconductor fabricating apparatus and absolutely decrease the interval of the wafer centering time by aligning the jig wafer with a pedestal by one wafer alignment process. CONSTITUTION: The jig wafer is loaded into a position over the pedestal by using a handler of a cassette(S1). The variation distance between the centers of the jig wafer and the pedestal is measured(S2). The centers of the jig wafer and the pedestal are aligned according to the variation distance(S3).