| 摘要 |
A method of forming a circuitry testing substrate for testing circuitry of another substrate which has a plurality of exposed conductors includes providing a base substrate having an outer surface. A plurality of receptacles are formed into the base substrate through the outer surface. The respective receptacles have a lateral periphery at the base substrate outer surface. Thereafter, conductive resistance heating material is formed over the base substrate outer surface elevationally outward of the respective receptacles and is received about at least a portion of the respective receptacle lateral peripheries. Thereafter, conductive engagement material is formed within the receptacles.
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