Apparatus and system for cooling electric circuitry, integrated circuit cards, and related components

摘要

The present invention relates to a significantly more effective method and apparatus for the removal of latent heat from integrated circuit boards. A significant increase in power density is achieved by utilizing the enclosure of an electronics package for spraying liquids onto integrated circuit boards and their components and associated heat sinks. The enclosure becomes a plenum or the injection source in the spray cooling process. In this manner cooling fluid can be supplied to the panels of the case housing of the electronic components